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FI-CDM and LICCDM testing on wafer, single die and package levels

dc.contributor.authorSimicic, Marko
dc.contributor.authorTakenaka, Hiroshi
dc.contributor.authorTamura, Shinichi
dc.contributor.authorClaes, Dieter
dc.contributor.authorShimada, Yohei
dc.contributor.authorSawada, Masanori
dc.contributor.authorChen, Shih-Hung
dc.date.accessioned2025-06-25T09:43:47Z
dc.date.available2024-12-01T23:12:00Z
dc.date.available2025-06-25T09:43:47Z
dc.date.issued2024
dc.identifier.isbn979-8-3503-6546-7
dc.identifier.issn0739-5159
dc.identifier.otherWOS:001337944800026
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44882.2
dc.sourceWOS
dc.titleFI-CDM and LICCDM testing on wafer, single die and package levels
dc.typeProceedings paper
dc.contributor.imecauthorSimicic, Marko
dc.contributor.imecauthorClaes, Dieter
dc.contributor.imecauthorChen, Shih-Hung
dc.contributor.orcidimecSimicic, Marko::0000-0002-3623-1842
dc.contributor.orcidimecClaes, Dieter::0000-0002-0356-0973
dc.contributor.orcidimecChen, Shih-Hung::0000-0002-6481-2951
dc.identifier.doi10.23919/EOS/ESD61719.2024.10702171
dc.identifier.eisbn978-1-58537-353-6
dc.source.numberofpages7
dc.source.peerreviewyes
dc.source.conference46th Annual Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)
dc.source.conferencedateSEP 16-18, 2024
dc.source.conferencelocationReno
dc.source.journalN/A
imec.availabilityPublished - imec


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220.500.12860/44882.2*2025-06-25T09:42:47Zvalidation by library/open access desk
120.500.12860/448822024-12-01T23:12:00Z

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