FI-CDM and LICCDM testing on wafer, single die and package levels

Abstract

Although not mainstream yet, Contact Charged Device Model (CDM) electrostatic discharge ( ESD) testers are being used by the industry. In this paper we compare the Low-Impedance Contact CDM tester to the industry standard Field-Induced CDM tester. We test an actual IC product at wafer, bare-die and package levels.