Publication:
A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects
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356 since deposited on 2024-12-06
18last month
5last week
Acq. date: 2026-10-04
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161 since deposited on 2024-12-06
Acq. date: 2026-10-04
Citations