Publication:
A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects
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140 since deposited on 2024-12-06
43last month
11last week
Acq. date: 2025-12-18
Views
154 since deposited on 2024-12-06
1last month
Acq. date: 2025-12-18
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