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Collective die-to-wafer assembly process for optically interconnected System-on-wafer
Publication:
Collective die-to-wafer assembly process for optically interconnected System-on-wafer
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Date
2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00227
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kennes, Koen
;
Dvoretskii, Anton
;
Podpod, Arnita
;
Xu, Pengfei
;
He, Junwen
;
Lepage, Guy
;
Golshani, Negin
;
Verheyen, Peter
;
Magdziak, Rafal
;
Bipul, Swetanshu
;
Phommahaxay, Alain
;
Chakrabarti, Maumita
;
Miller, Andy
;
Beyne, Eric
;
Ban, Yoojin
;
Ferraro, Filippo
;
van Campenhout, Joris
Journal
N/A
Abstract
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431
since deposited on 2024-12-07
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last month
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last week
Acq. date: 2026-01-10
Citations
Metrics
Views
431
since deposited on 2024-12-07
4
last month
1
last week
Acq. date: 2026-01-10
Citations