Publication:

Collective die-to-wafer assembly process for optically interconnected System-on-wafer

Date

2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00227
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Author(s)

Kennes, Koen  
;
Dvoretskii, Anton  
;
Podpod, Arnita  
;
Xu, Pengfei  
;
He, Junwen  
;
Lepage, Guy  
;
Golshani, Negin  
;
Verheyen, Peter  
;
Magdziak, Rafal  
;
Bipul, Swetanshu  
;
Phommahaxay, Alain  
;
Chakrabarti, Maumita  
;
Miller, Andy  
;
Beyne, Eric  
;
Ban, Yoojin  
;
Ferraro, Filippo  
;
van Campenhout, Joris

Journal

N/A

Abstract

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Acq. date: 2026-02-24

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