Publication:

Multi-tier die stacking through collective die-to-wafer hybrid bonding.

Date

2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00106
Simple item page Full metadata Statistics
Loading...
Thumbnail Image

Author(s)

Kennes, Koen  
;
Lin, Ye  
;
Suhard, Samuel  
;
Bex, Pieter  
;
Cuypers, Dieter  
;
Guerrero, Alice
;
Bumueller, Dennis
;
Phommahaxay, Alain  
;
Beyer, Gerald  
;
Beyne, Eric  

Journal

N/A

Abstract

Description

Statistics

Views

254 since deposited on 2024-12-07
2last month
Acq. date: 2026-06-05

Citations

Statistics

Views

254 since deposited on 2024-12-07
2last month
Acq. date: 2026-06-05

Citations