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Impact of Pitch Scaling on 3D Die-to-Die Interconnects
Publication:
Impact of Pitch Scaling on 3D Die-to-Die Interconnects
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Date
2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00171
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Pantano, Nicolas
;
Stucchi, Michele
;
Van der Plas, Geert
;
Beyne, Eric
Journal
N/A
Abstract
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Acq. date: 2026-01-08
Citations
Metrics
Views
263
since deposited on 2024-12-07
3
last month
1
last week
Acq. date: 2026-01-08
Citations