Publication:

Impact of Pitch Scaling on 3D Die-to-Die Interconnects

Date

2024

Proceedings Paper

https://doi.org/10.1109/ectc51529.2024.00171

Simple item page Full metadata Statistics

Author(s)

Pantano, Nicolas

;

Stucchi, Michele

;

Van der Plas, Geert

;

Journal

N/A

Statistics

278 since deposited on 2024-12-07

3last month

Acq. date: 2026-08-24