Publication:
20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering
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236 since deposited on 2024-12-07
3last month
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Acq. date: 2026-01-08
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Views
236 since deposited on 2024-12-07
3last month
1last week
Acq. date: 2026-01-08
Citations