Publication:

Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology

Date

2024

Proceedings Paper

https://doi.org/10.1109/ESSERC62670.2024.10719443

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Author(s)

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Sankatali, Venkateswarlu

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;

;

Singh, Pushpapraj

;

Catthoor, Francky

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Ryckaert, Julien

;

Biswas, Dwaipayan

Journal

N/A

Statistics

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Acq. date: 2026-06-02