Publication:

Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology

Date

2024

Proceedings Paper

https://doi.org/10.1109/esserc62670.2024.10719443

Simple item page Full metadata Statistics

Author(s)

;

;

Sankatali, Venkateswarlu

;

;

;

Singh, Pushpapraj

;

Catthoor, Francky

;

;

Ryckaert, Julien

;

Biswas, Dwaipayan

Journal

N/A

Statistics

285 since deposited on 2025-02-02

1last month

Acq. date: 2026-10-07