Publication:

Simulations of Wafer-to-Wafer Bonding Dynamics and Deformation Mechanisms

Date

2024

Proceedings Paper

https://doi.org/10.1109/ESTC60143.2024.10712136

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Author(s)

Okudur, Oguzhan Orkut

;

;

;

Gonzalez, Mario

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Journal

N/A

Statistics

283 since deposited on 2025-02-15

Acq. date: 2026-06-06