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Scatterometry Application on Cu/SiCN surface topography towards high volume manufacturing
Publication:
Scatterometry Application on Cu/SiCN surface topography towards high volume manufacturing
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Date
2024
Proceedings Paper
https://doi.org/10.1109/ESTC60143.2024.10712071
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Chew, Soon Aik
;
Hung, Joey
;
Turovets, Igor
;
Saib, Mohamed
;
Ger, Avron
;
Moussa, Alain
;
Zhang, Boyao
;
De Vos, Joeri
;
Miller, Andy
;
Charley, Anne-Laure
;
Leray, Philippe
;
Beyne, Eric
Journal
N/A
Abstract
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247
since deposited on 2025-02-15
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Acq. date: 2025-12-11
Citations
Metrics
Views
247
since deposited on 2025-02-15
2
last month
Acq. date: 2025-12-11
Citations