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Scatterometry Application on Cu/SiCN surface topography towards high volume manufacturing

dc.contributor.authorChew, Soon Aik
dc.contributor.authorHung, Joey
dc.contributor.authorTurovets, Igor
dc.contributor.authorSaib, Mohamed
dc.contributor.authorGer, Avron
dc.contributor.authorMoussa, Alain
dc.contributor.authorZhang, Boyao
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorMiller, Andy
dc.contributor.authorCharley, Anne-Laure
dc.contributor.authorLeray, Philippe
dc.contributor.authorBeyne, Eric
dc.date.accessioned2025-04-16T08:46:15Z
dc.date.available2025-02-15T21:13:58Z
dc.date.available2025-04-16T08:46:15Z
dc.date.issued2024
dc.identifier.isbn979-8-3503-9037-7
dc.identifier.issn2687-9700
dc.identifier.otherWOS:001340802800075
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45210.2
dc.sourceWOS
dc.titleScatterometry Application on Cu/SiCN surface topography towards high volume manufacturing
dc.typeProceedings paper
dc.contributor.imecauthorChew, Soon Aik
dc.contributor.imecauthorSaib, Mohamed
dc.contributor.imecauthorMoussa, Alain
dc.contributor.imecauthorZhang, Boyao
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorCharley, Anne-Laure
dc.contributor.imecauthorLeray, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecChew, Soon Aik::0000-0003-3013-4846
dc.contributor.orcidimecSaib, Mohamed::0000-0002-5153-5553
dc.contributor.orcidimecMoussa, Alain::0000-0002-6377-4199
dc.contributor.orcidimecZhang, Boyao::0000-0002-7976-0146
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecCharley, Anne-Laure::0000-0003-4745-0167
dc.contributor.orcidimecLeray, Philippe::0000-0002-1086-270X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/ESTC60143.2024.10712071
dc.identifier.eisbn979-8-3503-9036-0
dc.source.numberofpages5
dc.source.peerreviewyes
dc.source.conference10th IEEE Electronics System-Integration Technology Conference (ESTC)
dc.source.conferencedateSEP 11-13, 2024
dc.source.conferencelocationBerlin
dc.source.journalN/A
imec.availabilityPublished - imec


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220.500.12860/45210.2*2025-04-16T08:43:56Zvalidation by library/open access desk
120.500.12860/452102025-02-15T21:13:58Z

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