Scatterometry Application on Cu/SiCN surface topography towards high volume manufacturing

Abstract

This study discusses the integration challenges to scale down the Hybrid Bonding (HB) pad pitch [1], focusing on three pitches: 1um, 0.7um, and 0.4um. Alternative high-volume manufacturing (HVM) metrology solutions are also investigated, focusing on Optical Critical Dimensions Metrology (OCD) with Machine learning (ML). This solution averts the complexities in scatterometry modeling arising from 3D Front-End-of-Line (FEOL) and Back-End-of-Line (BEOL) underlayer structures.