Browsing by author "Leray, Philippe"
Now showing items 1-20 of 117
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21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019) -
28nm pitch single exposure patterning readiness by metal oxide resist on 0.33NA EUV Lithography
Kim, Il Hwan; Kim, Insung; Park, Changmin; Lee, Jsiun; Ryu, Koungmin; De Schepper, P.; Doise, J.; Kocsis, M.; De Simone, Danilo; Kljucar, Luka; Das, Poulomi; Blanc, Romuald; Beral, Christophe; Severi, Joren; Vandenbroeck, Nadia; Foubert, Philippe; Charley, Anne-Laure; Oak, Apoorva; Xu, Dongbo; Gillijns, Werner; Mitard, Jerome; Tokei, Zsolt; van der Veen, Marleen; Heylen, Nancy; Teugels, Lieve; Le, Quoc Toan; Schleicher, Filip; Leray, Philippe; Ronse, Kurt (2021) -
28nm-pitch Ru interconnects patterned with 0.33NA-EUV single exposure
Das, Sayantan; Kisson, Nicola; Mahmud Ul Hasan, Hasan MD; Rynders, Luc; Kljucar, Luka; Halder, Sandip; Leray, Philippe; Dusa, Mircea; Rio, David; Mohsen, Mahmoud; Spence, Chris; De Poortere, Etienne (2021) -
3D features measurement using YieldStar, an angle resolved polarized scatterometer
Charley, Anne-Laure; Leray, Philippe; D'have, Koen; Cheng, Shaunee; Hinnen, Paul; Li, Fahong; Vanoppen, Peter; Dusa, Mircea (2011) -
3D features measurement using Yieldstar, an angle resolved polarized scatterometer
Charley, Anne-Laure; Leray, Philippe; D'have, Koen; Cheng, Shaunee; Hinnen, P.; Li, Fahong; Vanoppen, Peter; Dusa, Mircea (2011) -
A CDU comparison of double-patterning process options using Monte Carlo simulation
Hooge, Joshua; Hatakeyama, Shinichi; Nafus, Kathleen; Scheer, Steven; Foubert, Philippe; Cheng, Shaunee; Leray, Philippe (2009) -
A novel isolation scheme featuring cavities in the collector for a high-speed 0.13μm SiGe:C BiCMOS technology
Choi, Li Jen; Van Huylenbroeck, Stefaan; Donkers, Johan; van Noort, Wibo; Piontek, Andreas; Sibaja-Hernandez, Arturo; Meunier-Beillard, Philippe; Neuilly, Francois; Kunnen, Eddy; Leray, Philippe; Vleugels, Frank; Venegas, Rafael; Hijzen, Erwin; Decoutere, Stefaan (2007) -
A single metrology tool solution for complete exposure tool setup
Laidler, David; D'have, Koen; Charley, Anne-Laure; Leray, Philippe; Cheng, Shaunee; Dusa, Mircea; Vanoppen, Peter; Hinnen, Paul (2010) -
Accuracy assessment between on product and on-optical-target overlay metrology with optical microscopy, SEM and STEM
Abranovitz, Yaniv; Levin, G.; Sarig, L.; Levi, S.; Adan, O.; Tilson, A.; Arjavac, J.; Strauss, M.; Kwakman, L.; Leray, Philippe; Halder, Sandip (2020) -
Accurate and reliable optical CD of MuGFET down to 10nm
Leray, Philippe; Lorusso, Gian; Cheng, Shaunee; Collaert, Nadine; Jurczak, Gosia; Shirke, S. (2007) -
Achieving optimum diffraction based overlay performance
Leray, Philippe; Laidler, David; Cheng, Shaunee; Coogans, Martyn; Fuchs, Andreas; Ponomarenko, Mariya; van der Schaar, Maurits; Vanoppen, Peter (2010) -
Advanced CD-SEM solution for edge placement error characterization of BEOL pitch 32nm metal layer
Charley, Anne-Laure; Leray, Philippe; Lorusso, Gian; Sutani, T.; Takemasa, Y. (2018) -
BEOL N2: M2 through SAxP process from MP21 to MP26: 193i SAQP vs EUV SADP
Hermans, Yannick; Wu, Chen; Buccheri, Nunzio; Schleicher, Filip; Versluijs, Janko; Montero Alvarez, Daniel; Dey, Bappaditya; Wong, Patrick; Rincon Delgadillo, Paulina; Park, Seongho; Tokei, Zsolt; Leray, Philippe; Halder, Sandip (2023-04-28) -
Characterisation of direct alignment for LFLE process
Laidler, David; Leray, Philippe; Cheng, Shaunee; Doytcheva, Maya; Tenner, Manfred; van Haren, Richard (2009) -
Characterization of overlay mark fidelity
Adel, M.; Ghinovker, M.; Poplawski, J.M.; Kassel, E.; Izikson, P.; Pollentier, Ivan; Leray, Philippe; Laidler, David (2003) -
Characterizing immersion lithography micro bridge defects using advanced features of teh SEMVision G3 STAR FIB
Van Den Heuvel, Dieter; Santoro, Gaetano; Gronheid, Roel; Braggin, Jennifer; Rosslee, Craig; Leray, Philippe; Cheng, Shaunee; Schreutelkamp, Rob; Hillel, Noam (2009) -
Cluster optimization to improve total CD control as an enabler for double patterning
Tedeschi, Len; Rosslee, C.; Laidler, David; Leray, Philippe; D'have, Koen (2008) -
Co-optimizatin of RegC and TWINSCANTM corrections to improve the intra-field on-product overlay performance
Gorhad, Kujan; Sharon, Ofir; Dmitriev, Vladimir; Cohen, Avi; van Haren, Richard; Roelofs, Christian; Cekli, H.E.; Gallagher, Emily; Leray, Philippe; Beyer, Dirk; Trautsch, Thomas; Steinert, Steffen (2016) -
Comparison of pattern placement errors as measured using traditional overlay targets and design rule structures
Leray, Philippe; Laidler, David; Pollentier, Ivan (2003) -
Connected component analysis of review-SEM images for sub-10nm node process verification
Halder, Sandip; Leray, Philippe; Sah, Kaushik; Cross, Andrew; Parisi, Paolo (2017)