Browsing by author "Leray, Philippe"
Now showing items 21-40 of 114
-
Deep learning-based defect detection using large FOV SEM for 28 nm pitch BEOL layer patterned with 0.33NA single exposure EUV
Das, Sayantan; Sah, Kaushik; Liang, Ardis; Roy, Hemanta; Tran, Kha; Babu, Binesh; Hegde, Arjun; Cross, Andrew; Leray, Philippe; Halder, Sandip (2021) -
Defect characterization of EUV Self-Aligned Litho-Etch Litho-Etch (SALELE) patterning scheme for advanced nodes
Sah, Kaushik; Cross, Andrew; Das, Sayantan; Blanco, Victor; Kljucar, Luka; Halder, Sandip; Leray, Philippe (2021) -
Design technology co-optimization for N10
Ryckaert, Julien; Raghavan, Praveen; Baert, Rogier; Garcia Bardon, Marie; Dusa, Mircea; Mallik, Arindam; Sakhare, Sushil; Vandewalle, Boris; Wambacq, Piet; Chava, Bharani; Croes, Kris; Dehan, Morin; Jang, Doyoung; Leray, Philippe; Liu, Tsung-Te; Miyaguchi, Kenichi; Parvais, Bertrand; Schuddinck, Pieter; Weemaes, Philippe; Mercha, Abdelkarim; Boemmels, Juergen; Horiguchi, Naoto; McIntyre, Greg; Thean, Aaron; Tokei, Zsolt; Cheng, Shaunee; Verkest, Diederik; Steegen, An (2014) -
Design-based metrology: beyond CD/EPE metrics to evaluate printability performance
Halder, Sandip; Mailfert, Julien; Leray, Philippe; Rio, David; Peng, Hsin-Ying; Laenens, Bart (2016) -
Detection of split design-related weak points in double patterning using PQW and bright-field defect inspection
Van Den Heuvel, Dieter; Cheng, Shaunee; Leray, Philippe; Wiaux, Vincent; Maenhoudt, Mireille; D'have, Koen; Jaenen, Patrick; Marcuccilli, Gino; Malik, Irfan; Klein, Sophie (2008) -
Diffraction based overlay metrology in the framework of double patterning
Leray, Philippe; Cheng, Shaunee (2008) -
Diffraction based overlay metrology: accuracy and performance on front end stack
Leray, Philippe; Cheng, Shaunee; Kandel, Daniel; Adel, Mike; Marchelli, Anat; Vakshtein, Irina; Vasconi, Mauro; Salski, Bartlomiej (2008) -
Diffraction based overlay re-assessed
Leray, Philippe; Laidler, David; D'have, Koen; Cheng, Shaunee (2011) -
e-beam metrology of thin resist for high NA EUVL
Lorusso, Gian; De Simone, Danilo; Zidan, Mohamed; Severi, Joren; Moussa, Alain; Dey, Bappaditya; Halder, Sandip; Goldenshtein, Alex; Houchens, Kevin; Santoro, Gaetano; Fischer, Daniel; Muellender, Angelika; Mack, Chris; Kondo, Tsuyoshi; Shohjoh, Tomoyasu; Ikota, Masami; Charley, Anne-Laure; De Gendt, Stefan; Leray, Philippe (2023) -
E-TEST validation of EPE budget and metrology
De Poortere, Etienne; Schelcher, Guillaume; Kissoon, Nicola; Paolillo, Sara; Tabery, Cyrus; Halder, Sandip; Leray, Philippe; Mulkens, Jan; McManus, Moyra (2020) -
E-test validation of space error budget and metrology
Schelcher, Guillaume; De Poortere, Etienne P.; Kissoon, Nicola; Paolillo, Sara; e Silva, Marsil A. C.; Zhang, Yichen; Tabery, Cyrus; Mulkens, Jan; McManus, Moyra; Leray, Philippe; Halder, Sandip (2022-06-30) -
Enabling CD SEM metrology for 5nm technology node and beyond
Lorusso, Gian; Ohashi, Takeyoshi; Yamaguchi, Astuko; Inoue, Osamu; Sutani, Takumichi; Horiguchi, Naoto; Boemmels, Juergen; Wilson, Chris; Briggs, Basoene; Tan, Chi Lim; Raymaekers, Tom; Delhougne, Romain; Van den Bosch, Geert; Di Piazza, Luca; Kar, Gouri Sankar; Furnemont, Arnaud; Fantini, Andrea; Donadio, Gabriele Luca; Souriau, Laurent; Crotti, Davide; Yasin, Farrukh; Appeltans, Raf; Rao, Siddharth; De Simone, Danilo; Rincon Delgadillo, Paulina; Leray, Philippe; Charley, Anne-Laure; Zhou, Daisy; Veloso, Anabela; Collaert, Nadine; Hasumi, Kazuhisa; Koshihara, Shunsuke; Ikota, Masami; Okagawa, Yutaka; Ishimoto, Toru (2017) -
Enhanced wafer overlay residuals control; deep sub-nanometer at sub-millimeter lateral resolution
Sufrin, Yael; Leray, Philippe; Canga, Eren; Cohen, Avi; Dmitriev, Vladimir; Gorhad, Kujan (2019) -
EUV based multi-patterning schemes for advanced DRAM nodes
Das, Sayantan; Sah, Kaushik; Fallica, Roberto; Chen, Zhijin; Halder, Sandip; Cross, Andrew; De Simone, Danilo; Treska, Fergo; Leray, Philippe; Kim, Ryan Ryoung han; Maguire, Ethan; Wei, Chih-, I; Fenger, Germain; Lafferty, Neal; Lee, Jeonghoon (2022) -
EUV lithography and the materials that propel it forward
Gallagher, Emily; Hendrickx, Eric; Kim, Ryan Ryoung han; Leray, Philippe; Philipsen, Vicky; Pollentier, Ivan; Rincon Delgadillo, Paulina; Ronse, Kurt; Timmermans, Marina; De Simone, Danilo (2020) -
EUV lithography qualification: Comparison of alternative wafer inspection methodologies and sensitivities
Halder, Sandip; Leray, Philippe (2018) -
EUV photoresist reference metrology using TEM tomography
Biedrzycki, Mark; Adiga, Umesh; Barnum, Andrew; Moussa, Alain; Arjavac, Jason; Haynes, Rose Marie; Charley, Anne-Laure; Leray, Philippe; Batuk, Dmitry (2020) -
Extraction of Roughness Measurements from Thin Resists with Low Signal-to-Noise-Ratio (SNR) SEM Images by Applying Deep Learning Denoiser
Zidan, Mohamed; Dey, Bappaditya; De Simone, Danilo; Severi, Joren; Charley, Anne-Laure; Halder, Sandip; Leray, Philippe; De Gendt, Stefan; Lorusso, Gian (2022) -
Focus and dose de-convolution technique for improved CD-control of immersion clusters
Charley, Anne-Laure; D'have, Koen; Leray, Philippe; Laidler, David; Cheng, Shaunee; Dusa, Mircea; Hinnen, Paul; Vanoppen, Peter (2010) -
Gate isolation technology for compact poly-CMP embedded flash memories
Slotboom, Michiel; Goarin, Pierre; Akil, Nader; Van Duuren, Michiel; Demand, Marc; Wouters, Johan M. D.; Beckx, Stephan; Leray, Philippe; Baerts, Christina; Heylen, Nancy; Pollentier, Ivan (2003)