Publication:

An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®

Date

2024

Proceedings Paper

https://doi.org/10.1109/estc60143.2024.10712025

Simple item page Full metadata Statistics

Author(s)

Ain, Kaneeze Noorul

;

;

Rodrigues, Augusto

;

Hasan, Md Nazmul

;

Holzmann, Dominik

;

;

Chatterjee, Urmimala

;

Roshanghias, Ali

Journal

N/A

Statistics

248 since deposited on 2025-02-15

1last month

Acq. date: 2026-09-18