Publication:

Thermal-Mechanical analysis of Electroplated copper for IC packaging

Date

2024

Proceedings Paper

https://doi.org/10.1109/ESTC60143.2024.10712132

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Author(s)

Salahouelhadj, Abdellah

;

Vanstreels, Kris

;

De Messemaeker, Joke

;

;

Slabbekoorn, John

;

;

Mudigere Krishne Gowda, Punith

;

Gonzalez, Mario

;

Metrics

210 since deposited on 2025-02-15

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Acq. date: 2026-01-09