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Redefining 2-Level Semi-Damascene Interconnect Technology: Benchmarking three different Fully Self-aligned Via options

dc.contributor.authorMarti, Giulio
dc.contributor.authorDelie, Gilles
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorGupta, Anshul
dc.contributor.authorKundu, Souvik
dc.contributor.authorDecoster, Stefan
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorHermans, Yannick
dc.contributor.authorKenens, Bart
dc.contributor.authorUlu Okudur, Fulya
dc.contributor.authorPark, Seongho
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2025-06-05T13:12:11Z
dc.date.available2025-03-06T20:46:38Z
dc.date.available2025-06-05T13:12:11Z
dc.date.issued2024
dc.identifier.isbn979-8-3503-8518-2
dc.identifier.issn2380-632X
dc.identifier.otherWOS:001411360600041
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45341.2
dc.sourceWOS
dc.titleRedefining 2-Level Semi-Damascene Interconnect Technology: Benchmarking three different Fully Self-aligned Via options
dc.typeProceedings paper
dc.contributor.imecauthorMarti, Giulio
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorGupta, Anshul
dc.contributor.imecauthorKundu, Souvik
dc.contributor.imecauthorDecoster, Stefan
dc.contributor.imecauthorKenens, Bart
dc.contributor.imecauthorPark, Seongho
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorDelie, Gilles
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorHermans, Yannick
dc.contributor.imecauthorUlu Okudur, Fulya
dc.contributor.orcidimecMurdoch, Gayle::0000-0002-6833-220X
dc.contributor.orcidimecGupta, Anshul::0000-0003-4276-5397
dc.contributor.orcidimecKundu, Souvik::0000-0001-5815-8765
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecKenens, Bart::0000-0003-2329-5449
dc.contributor.orcidimecPark, Seongho::0000-0002-1058-9424
dc.contributor.orcidimecTokei, Zsolt::0000-0003-3545-3424
dc.contributor.orcidimecDelie, Gilles::0000-0002-5646-3261
dc.contributor.orcidimecVarela Pedreira, Olalla::0000-0002-2987-1972
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecHermans, Yannick::0000-0002-6973-0795
dc.contributor.orcidimecUlu Okudur, Fulya::0000-0002-8046-7748
dc.identifier.doi10.1109/IITC61274.2024.10732570
dc.identifier.eisbn979-8-3503-8517-5
dc.source.numberofpages3
dc.source.peerreviewyes
dc.source.conference2024 International Interconnect Technology Conference
dc.source.conferencedateJUN 03-06, 2024
dc.source.conferencelocationSan Jose
dc.source.journalN/A
imec.availabilityPublished - imec


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220.500.12860/45341.2*2025-06-05T13:08:25Zvalidation by library/open access desk
120.500.12860/453412025-03-06T20:46:38Z

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