Publication:

Low Resistance Stacked Via Metallization for Future Interconnects

Date

2024

Proceedings Paper

https://doi.org/10.1109/IITC61274.2024.10732187

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Author(s)

van der Veen, Marleen

;

Farokhnejad, Anita

;

Mandal, Akhilesh Kumar

;

Struyf, Herbert

;

;

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190 since deposited on 2025-03-06

Acq. date: 2026-04-05