Browsing Articles by imec author "3519f96ac85d2e89287afdab586b96bb73f6d988"
Now showing items 1-8 of 8
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Advances in failure analysis techniques for 3D-technology
De Wolf, Ingrid; Jacobs, Kristof J.P. (2017) -
Defect localization of metal interconnection lines in 3-dimensional through-silicon-via structures by differential scanning photocapacitance microscopy
Jacobs, Kristof J.P.; Stucchi, Michele; Afanasiev, Valeri; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Beyne, Eric (2018) -
Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy
Jacobs, Kristof J.P.; Stucchi, Michele; Beyne, Eric (2021) -
Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices
Jacobs, Kristof J.P.; Wang, Teng; Stucchi, Michele; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Beyne, Eric (2017) -
Magnetic field imaging and light induced capacitance alteration for failure analysis of Cu-TSV interconnects
De Wolf, Ingrid; Jacobs, Kristof J.P.; Orozco, Antonio (2020) -
New technique localizes defects in 3D chips
Jacobs, Kristof J.P.; Parton, Els (2017) -
Optical beam-based defect localization methodologies for open and short failures in micrometer-scale 3-D TSV interconnects
Jacobs, Kristof J.P.; Li, Yunlong; Stucchi, Michele; De Wolf, Ingrid; Van Huylenbroeck, Stefaan; De Vos, Joeri; Beyne, Eric (2020) -
Reliability of p-GaN Gate HEMTs in Reverse Conduction
Cingu, Deepthi; Li, Xiangdong; Bakeroot, Benoit; Amirifar, Nooshin; Geens, Karen; Jacobs, Kristof J.P.; Zhao, Ming; You, Shuzhen; Groeseneken, Guido; Decoutere, Stefaan (2021)