Properties of TiN thin films deposited by ALCVD as barriers for Cu metallization

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Authors
Satta, Alessandra; Beyer, Gerald; Maex, Karen; Elers, K.; Haukka, S.; Vantomme, Andre
Conference
Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics
Title
Properties of TiN thin films deposited by ALCVD as barriers for Cu metallization
Publication type
Proceedings paper
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