Browsing Presentations by imec author "1490484971050155a2d43eeeaececec32060716d"
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Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask
Van Olmen, Jan; Al-Bayati, A; Beyer, Gerald; Boelen, Pieter; Carbonell, Laure; Zhao, Chao; Ciofi, Ivan; Claes, Martine; Cockburn, Andrew; Druais, Gael; Hendrickx, Dirk; Heylen, Nancy; Kesters, Els; Lytle, S.; Noori, A.; Op de Beeck, Maaike; Struyf, Herbert; Tokei, Zsolt; Versluijs, Janko (2007) -
Profile control for low-k patterning using TaN and TiN metallic hardmasks
Struyf, Herbert; Hendrickx, Dirk; Paraschiv, Vasile; Campos Garcia, Diana; Mannaert, Geert; Boullart, Werner; Vanhaelemeersch, Serge (2007) -
Residue formation in MHM-based low-k etch
Goossens, Danny; de Marneffe, Jean-Francois; Conard, Thierry; Hendrickx, Dirk; Struyf, Herbert; Boullart, Werner (2008) -
Resist strip and Cu diffusion barrier etch in Cu BEOL integration schemes in a Mattson Highlands chamber
Mannaert, Geert; Van Cauwenberghe, M.; Schmidt, Michael; Van Aelst, Joke; Hendrickx, Dirk; Stucchi, Michele; Conard, Thierry; Vanhaelemeersch, Serge; Boullart, Werner (2002) -
The potential for Cu-free ni plated contacts enabled by smart wire connection technology
Russell, Richard; Tous, Loic; Uruena De Castro, Angel; Kuzma Filipek, Izabela; Hendrickx, Dirk; Duerinckx, Filip; Szlufcik, Jozef; Soederstroem, Thomas; Yao, Yu; Bertens, Jurgen (2014)