Browsing Presentations by imec author "23f367559dd9031027f0efe03c529218ea9006a9"
Now showing items 1-8 of 8
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Compact thermal modelling of hot spots in 3D-stacked ICs
Beyne, Eric; Oprins, Herman (2010) -
Cooling of microelectronics using electrostatic actuated liquid droplets
Oprins, Herman; Vandevelde, Bart; Baelmans, Martine (2007) -
Effect of insolation on the thermal behaviour of the IPERC and the MWT cell
Dubey, Vikas; Govaerts, Jonathan; Catthoor, Francky; Oprins, Herman; Chatterjee, Urmimala; Muthirayan, Buvana; Baert, Kris (2012) -
Extracting thermal parameters from electronic pacakges
Oprins, Herman; Vandevelde, Bart (2007) -
Hybrid integration of multi-finger HEMTs: A comparison between flip-chip and substrate removal
Das, Johan; Ruythooren, Wouter; Vandersmissen, Raf; Oprins, Herman; Derluyn, Joff; Germain, Marianne; Borghs, Gustaaf (2005) -
Thermal and mechanical aspects for flexible embedded components
Vandevelde, Bart; Brebels, Steven; Okoro, Chukwudi; Oprins, Herman; Chen, L.C. (2007) -
Thermal aspects of 3D and 2.5D integration
Oprins, Herman; Cherman, Vladimir; Van der Plas, Geert; Beyne, Eric (2014) -
Thermal modeling and experimental validation of thermal effects of 3D-ICs
Srinivasan, Adi; Cheng, Edmund; Oprins, Herman; Van der Plas, Geert (2010)