Browsing Presentations by imec author "4bbc203dc5451ab5a42627cf713d1b4125d3c0c1"
Now showing items 1-15 of 15
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Chip-package interaction
De Wolf, Ingrid; Vandevelde, Bart; Debecker, Bjorn; Ivankovic, Andrej; Vanstreels, Kris; Gonzalez, Mario; Lofrano, Melina; Guo, Wei; Cherman, Vladimir (2013) -
Fatigue lifetime of stretchable interconnects
Gonzalez, Mario; Hsu, Yung-Yu; Bossuyt, Frederick; Vanfleteren, Jan; De Wolf, Ingrid (2011) -
Fundamental analysis of the collapse of nano-patterns during wet-processing of advanced interconnects
Zahedmanesh, Houman; Le, Quoc Toan; Vanstreels, Kris; Gonzalez, Mario; Tokei, Zsolt (2017) -
Impact of thinning and packaging on a deep sub-micron CMOS product
Perry, Dan; Ray, Urmi; Gu, Sam; Nakamoto, Mark; Sy, Wing; Wang, Kevin; Ruythooren, Wouter; Yang, Yu; De Wolf, Ingrid; Cotrin Teixeira, Ricardo; Gonzalez, Mario; Simons, Veerle; Berry, Christopher J.; Lee, KiWook; Burggraf, Jürgen; Pargfrieder, Stefan (2009) -
Mechanical properties of thin deep ultraviolet (DUV) photoresist films after ion implantation
Vanstreels, Kris; Gonzalez, Mario (2009) -
Mechanical stability of advanced nano-interconnects
Vanstreels, Kris; Zahedmanesh, Houman; Gonzalez, Mario (2020) -
Modeling of stretchable interconnections
Gonzalez, Mario; Axisa, Fabrice; Vanden Bulcke, Mathieu; Brosteaux, Dominique; Vandevelde, Bart; Vanfleteren, Jan (2007) -
Numerical and experimental analysis of stretching induced interconnect delamination
van der Sluis, Olaf; Hsu, Yung-Yu; Timmermans, P.H.M.; Gonzalez, Mario; Hoefnagels, J.P.M. (2009) -
Patternable silicones for next generation packaging reliability requirements
Kunselman, Michael; Larson, Lyndon; Harkness, Brian; Gardner, Geoff; Alger, James; Cummings, Michelle; Meynen, Herman; Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric (2004) -
Reliability of the stretchable interconnect in a conformable matrix
Jablonski, Michal; Bossuyt, Frederick; Vervust, Thomas; Vanfleteren, Jan; Gonzalez, Mario (2011) -
Size-dependent strain relaxation in GaN nanopillars
Tseng, Peter; Gonzalez, Mario; Sijmus, Bram; Lieten, Ruben; Cheng, Kai; Borghs, Gustaaf (2011) -
Stretchable circuit technologies (Tutorial Part 2)
Gonzalez, Mario (2009) -
Thermo-mechanical reliability of electronic packages
Gonzalez, Mario (2012) -
Thermomechanical challenges for device interconnect and advanced packaging
Gonzalez, Mario (2020) -
Tutorial Part 3: Stretchable Circuit Technology - Mechanical Modelling
Gonzalez, Mario (2011)