Browsing Presentations by imec author "f7c060856060171ab0565fd41170658e4ab08723"
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A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film
Travaly, Youssef; Tsutsue, M.; Ikeda, Atsushi; Verdonck, Patrick; Tokei, Zsolt; Willegems, Myriam; Van Aelst, Joke; Struyf, Herbert; Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Heylen, Nancy; Sinapi, Fabrice; Richard, Olivier; De Roest, David; Kaneko, S; Kemeling, N; Fukazawa, A; Matsuki, N; Matsushita, K; Tsuji, N; Kagami, K; Sprey, Hessel; Beyer, Gerald (2007) -
Back-end, low-k dielectric compatible resist rework procedure
Reybrouck, Mario; Vangoidsenhoven, Diziana; Maenhoudt, Mireille; Van Aelst, Joke; Boullart, Werner (2002) -
Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect
Zhang, Wenqi; Brongersma, Sywert; Van Aelst, Joke; Richard, Olivier; Bamal, Mandeep; Heylen, Nancy; Li, Yunlong; Beyer, Gerald; Maex, Karen (2005) -
Resist strip and Cu diffusion barrier etch in Cu BEOL integration schemes in a Mattson Highlands chamber
Mannaert, Geert; Van Cauwenberghe, M.; Schmidt, Michael; Van Aelst, Joke; Hendrickx, Dirk; Stucchi, Michele; Conard, Thierry; Vanhaelemeersch, Serge; Boullart, Werner (2002) -
Wafer bevel protection during deep reactive ion etching
Charavel, Remy; Gassot, Pierre; de Backer, E.; Altamirano Sanchez, Efrain; Van Aelst, Joke; Devriendt, Katia; Van Wichelen, Koen (2010)