Browsing Presentations by imec author "f9cf9f86cc33f2e3957973df01d8e54b50a9e3e2"

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Cu plating of through-Si vias for 3D-stacked integrated circuits

Radisic, Alex; Luhn, Ole; Swinnen, Bart; Bender, Hugo; Drijbooms, Chris; Doumen, Geert; Kellens, Kristof; Ruythooren, Wouter; Vereecken, Philippe (2008)
Integration of vertical carbon nanotube bundles for applications as contacts

Chiodarelli, Nicolo; Kellens, Kristof; Cott, Daire; Peys, Nick; Arstila, Kai; Heyns, Marc; De Gendt, Stefan; Groeseneken, Guido; Vereecken, Philippe (2009)
Metallization options for sub- 30 nm interconnects: comparison of Cu and W metallizations

Carbonell, Laure; Caluwaerts, Rudy; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Mertens, Sofie; Van Ammel, Annemie; Van Roey, Frieda; Cockburn, Andrew; Gravey, Virgine; Shah, Kavita; Rajagopalan, Ravi; Tokei, Zsolt; Beyer, Gerald (2010)
Tackling corrosion issues that occur during the chemical mechanical polishing process

Teugels, Lieve; Kellens, Kristof; Heylen, Nancy (2012)