Publication:
Diffusion and adhesion issues of low permittivity dielectrics with copper for high performance interconnects
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2042 since deposited on 2021-10-14
2last month
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Acq. date: 2026-04-06
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Statistics
Views
2042 since deposited on 2021-10-14
2last month
1last week
Acq. date: 2026-04-06
Citations