Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification

Publication:

2003

Journal article

Author(s)

Chandrasekhar, Arun

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;

Driessens, Evelien

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;

;

;

;

Van Puymbroeck, Jef

IEEE Trans. Electronics Packaging Manufacturing

2051 since deposited on 2021-10-15

1last month

Acq. date: 2026-01-26