Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
Study of deposition behavior of thermal/plasma-enhanced chemical vapor deposition (CVD/PECVD) of manganese on porous SiCOH low-k dielectric materials for copper diffusion barrier application in advanced interconnect technology
Statistics
Statistics by Category
Download view's map
PNG
JPEG/JPG
Reports
Most viewed
Most viewed per month
Top city views
File Visits
Export Excel
Export CSV
Item
Views
Study of deposition behavior of thermal/plasma-enhanced chemical vapor deposition (CVD/PECVD) of manganese on porous SiCOH low-k dielectric materials for copper diffusion barrier application in advanced interconnect technology
1346