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Study of deposition behavior of thermal/plasma-enhanced chemical vapor deposition (CVD/PECVD) of manganese on porous SiCOH low-k dielectric materials for copper diffusion barrier application in advanced interconnect technology
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1962 since deposited on 2021-10-20
Acq. date: 2026-01-05
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1962 since deposited on 2021-10-20
Acq. date: 2026-01-05
Citations