Browsing by Author "Allaert, K."
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Publication A new cost-effective TAB technology for small and medium volumes
Proceedings paper1995, Proceedings of the 10th European Microelectronics Conference; May 1995; Copenhagen, Denmark., p.547-558Publication Characterization of integrated resistors for broadband telecom printed circuit boards
Proceedings paper1996, Proceedings of the Technical Conference IPC Printed Circuits Expo 1996; 3-7 March 1996; San Jose, CA, USA., p.S6-1-1->S6-1-10Publication Electroless nickel-gold stud bumping on laminate for flip-chip assembly
; Publication Experimental thermal characterisation of electronic components by means of the submerged double jet impingement (SDJI) method
Proceedings paper1997, International Systems Packaging Symposium - ISPS, 2/12/1997, p.254-259Publication Experimental thermal characterisation of electronic packages in a fluid bath environment
Proceedings paper1997, Thermal Management of Electronic Systems II. Proceedings of EUROTHERM Seminar No 45, 20/09/1995, p.137-148Publication Flip-chip assembly for chips with gold bumps on high density thic film substrates
Proceedings paper1997, Proceedings of the 11th European Microelectronics Conference; 14-16 May 1997. Venice, Italy., p.175-182Publication Interconnection technology for advanced high density thick films
Proceedings paper1995, Proceedings of the 10th European Microelectronics Conference; May 1995; Copenhagen, Denmark., p.190-198Publication Mixed assembly of PCB using a novel flip-chip technology
Journal article2000, Advancing Microelectronics, (27) 5, p.28-30Publication Mixed assembly on PCB using a novel flip-chip technology
Proceedings paper2000, IMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings, 18/06/2000, p.65-70Publication Multifibre Electro-Optical Modules Compatible with the Fibre in Board Technology
Publication Photo-imageable thick films for multichip modules
; Publication Photoimaginable thick films for multi chip modules
; Publication Photovia technology: some important aspects for reliability
Proceedings paper1999, Proceedings of the IMAPS; October 1999; Chicago, USA., p.240-245Publication Radiated emission of PCB tracks
Proceedings paper1996, EuPac '96.2nd European Conference on Electronic Packaging Technology and 8th International Conference on Interconnection Technol, p.140-142Publication Samenwerking Industrie-Universiteit Helpt de EMC-Materie te Ontmaskeren
Journal article1995, Het Ingenieursblad, 64, p.21-34Publication The realisation of photo-via technology using multiposit as a photo imageable dielectric
Proceedings paper1998, Proceedings of the 3rd European Conference on Electronic Packaging Technology and 9th International Conference on Interconnectio, 15/06/1998, p.62-65Publication The use of integrated resistors and buried capacitance in high performance telecom printed circuit boards
Proceedings paper1996, EuPac '96.2nd European Conference on Electronic Packaging Technology and 8th International Conference on Interconnection Technol, p.11-14Publication Thermo-mechanical analysis of flip chip on substrate bumps - assemblies
Proceedings paper1997, Proceedings of the 11th ISHM European Microelectronics Conference - EMC, 14/05/1997, p.603-606Publication Thermomechanical models for leadless solder interconnections in flip chip assemblies
Journal article1998, IEEE Trans. Components, Packaging, and Manufacturing Technology. Part A, (21) 1, p.177-85