Browsing by Author "Ansell, Oliver"
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Publication Comparison Between Wet and Dry Silicon Via Reveal in 3D Backside Processing
Proceedings paper2015, 12th Wafer-Level Packaging Symposium, 2015-10-13Publication Etch process modules development and integration in 3D SOC applications
Meeting abstract2017, 10th International Workshop on Plasma Etch and Strip in Microtechnology - PESM, 19/10/2017Publication Extreme thinning of Si wafers for via-last and multi wafer stacking applications
Proceedings paper2018, IEEE 68th Electronic Components and Technology Conference - ECTC, 29/05/2018, p.1-8Publication Extreme wafer thinning optimization for via-last applications
; ; ; ; ; Proceedings paper2016, IEEE International Conference on 3D System Integration - 3DIC, 8/11/2016, p.1-4