Browsing by Author "Atanasova, Tanya"
- Results per page
- Sort Options
Publication Adsorption/desorption of suppressor complex on copper: description of the critical potential
Proceedings paper2011-01, Molecular Structure of the Solid-Liquid Interface and Its Relationship to Electrodeposition 7, 9/10/2010, p.13-26Publication Adsorption/desorption of suppressor complex on copper: description of the critical potential
Meeting abstract2010, 218th ECS Meeting Symposium 'Molecular Structure of the Solid-Liquid Interface and its Relationship to Electrodeposition 7', 10/10/2010, p.2039Publication Characterization of threading dislocations in thin germanium layers by defect etching: towards chromium and HF free solution
Journal article2008, Journal of the Electrochemical Society, (155) 9, p.H673-H681Publication Effect of ionic strength and the electrolyte composition on the suppression of copper deposition by PEG
Proceedings paper2010, Fundamentals of Electrochemical Growth: From UPD to Microstructures - Symposium in Memory of Prof. Evgeni Budevski, 4/10/2009, p.67-78Publication Electrochemical determination of the cupric ion activity in aqueous acidic cupric sulfate electrolytes
Journal article2013, Journal of the Electrochemical Society, (160) 2, p.D60-D65Publication Physicochemical mechanism of damascene copper plating: effect of suppressor
Meeting abstract2009, 216th ECS Meeting, 4/10/2009, p.2708Publication Seed-less copper electrochemical deposition on PVD resistive substrates as a replacement/enhancement for PVD Cu seed layers in HAR TSVs
Proceedings paper2010, Electrochemical Engineering for the 21st Century (dedicated to Richard C. Alkire), 24/04/2010, p.77-87Publication Ultra-low copper baths for sub-30nm copper interconnects
Meeting abstract2011, 220th ECS Fall Meeting Symposium F4: Semiconductors, Metal Oxides and Composites, 9/10/2011, p.2330Publication Ultra-low copper baths for sub-35 nm copper interconnects
Journal article2013, Journal of the Electrochemical Society, (160) 12, p.D3222-D3259Publication Ultra-low copper baths for sub-35nm copper interconnects
Atanasova, TanyaOral presentation2011, IMEC PhD Conference Fun in ResearchPublication Ultra-low copper baths for sub-35nm copper interconnects
Proceedings paper2012, Processing Materials of 3D Interconnects, Damascene and Electronics Packaging, 9/10/2011, p.83-97Publication Wafer-scale Cu plating uniformity on thin Cu seed layers
Journal article2013, Electrochimica Acta, 104, p.242-248