Browsing by Author "Bisson, Peter"
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Publication 300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications
Meeting abstract2010-11, IEEE International 3D System Integration Conference - 3DIC, 16/11/2010Publication Process characterization of thin wafer debonding with thermoplastic materials
Proceedings paper2012, 4th Electronics System Integration technologies Conference - ESTC, 17/09/2012Publication Temporary wafer bonding defect impact assessment on substrate thinning, process enhancement through systematic defect track down
Proceedings paper2012, IEEE 62nd Electronic Components and Technology Conference - ECTC, 29/05/2012, p.1255-1259Publication Ultrathin wafer handling in 3D stacked IC manufacturing combining a novel zoneBOND™ temporary bonding process with room temperature peel debonding
Proceedings paper2012, IEEE International 3D Systems Integration Conference - 3DIC, 31/01/2012