Browsing by Author "Boit, Christian"

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Contactless fault isolation of ultra low k dielectrics in soft breakdown condition

Herfurth, Norbert
;
Wu, Chen
;
De Wolf, Ingrid
;
Croes, Kristof
;
Boit, Christian
Proceedings paper
2018, International Symposium on the Physical and Failure Analysis of Integrated Circuits - IPFA, 16/07/2018, p.1-5
Detection of Failure Mechanisms in 24-40 nm FinFETs with (spectral) photon emission techniques using InGaAs camera

Vogt, Ivo
;
Nakamura, T.
;
De Wolf, Ingrid
;
Boit, Christian
Journal article
2018, Microelectronics Reliability, 88-90, p.334-338
New access to soft breakdown parameters of low k dielectrics through localization-based analysis

Herfurth, Norbert
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Simon-Najasek, M.
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Herfurth, R.
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Hübner, S.
;
Altmann, Frank
;
Beyreuther, A.
Proceedings paper
2019, 2019 IEEE International Reliability Physics Symposium (IRPS), 31/03/2019
Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation

Herfurth, Norbert
;
Wu, Chen
;
Beureuther, A.
;
Nakamura, T.
;
De Wolf, Ingrid
;
Simon-Najasek, M.
Journal article
2019, Microelectronics Reliability, 92, p.73-78