Browsing by Author "Brand, Sebastian"
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Publication 3D Localization of liner breakdown within Cu filled TSV?s by backside LIT and PEM defocusing series
Proceedings paper2017, 43rd International Symposium for Testing and Failure Analysis - ISTFA, 5/11/2017, p.38-43Publication Acoustic and photoacoustic inspection of through-silicon-vias in the GHz-frequency band
Proceedings paper2017, 43rd Intenational Symposium for Testing and Failure Analysis - ISTFA, 5/11/2017Publication An alternative application of ToF-SIMS/in-situ AFM: controlled sample preparation for IC failure analysis
Oral presentation2019, SIMS 22 - 22nd International Conference on Secondary Ion Mass SpectrometryPublication Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.
Proceedings paper2018-11, International Symposium for Testing and Failure Analysis - ISTFA, 28/10/2018, p.8-11Publication Failure and stress analysis of Cu TSVs using
Proceedings paper2015, 41st International Symposium for Testing and Failure Analysis - ISTFA, 1/11/2015, p.119-25Publication GHz-Scanning Acoustic Microscopy combined with TOFSIMS/AFM for wafer-level failure analysis of bonding interfaces
Proceedings paper2019, 45th International Symposium for Testing and Failure Analysis (ISTFA), 10/11/2019Publication Investigating stress measurement capabilities using GHz scanning acoustic microscopy for 3D failure analysis
Journal article2016, Microelectronics Reliability, 64, p.336-340Publication Study of GHz-SAM sensitivity to delamination in BEOL layers
Journal article2017, Microelectronics Reliability, 76-77, p.238-242Publication Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR)
Proceedings paper2021, 17th IEEE International Conference on Automation Science and Engineering (CASE), AUG 23-27, 2021, p.395-400