Browsing by Author "Celis, Jean-Pierre"
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Publication A new generic surface micromachining module for MEMS hermetic packaging at temperatures below 200° C
Journal article2007, Microsystem Technologies, (13) 11_12, p.1451-1456Publication A novel approach to characterise a low-k dielectric polymer surface
Proceedings paper2002, 2nd International Symposium on Polymers Surface Characterization, 11/11/2002Publication A novel approach to characterization of a low-k dielectric polymer surface
Publication Additive influence on filling microvias with copper
Oral presentation2008, Gordon Research ConferencePublication Agent-based modeling of mems fluidic self-assembly
Proceedings paper2010, IEEE International Conference on Micro Electro Mechanical Systems - MEMS, 24/01/2010, p.476-479Publication An investigation of stiction in Poly-SiGe micromirror
Proceedings paper2011, IEEE 61st Electronic Components and Technology Conference - ECTC, 31/05/2011, p.157-162Publication Anisotropy studies of magnetic thin films on GaAs
Oral presentation1999, Condensed Matter and Material Physics; 19-22 December 1999; Leicester, UK.Publication Anodic bonding and heterojunction emitter for thin-film silicon solar cell: two steps towards an epitaxy-free lift-off cell
Proceedings paper2007, 22nd European Photovoltaic Solar Energy Conference and Exhibition, 3/09/2007, p.1997-2000Publication Anodisation of branched and columnar macropores in n-type silicon under front-side illumination
Journal article2007-06, Physica Status Solidi C, (4) 6, p.1928-1932Publication Barrier and seed layer coverage in 3D structures with different aspect ratios using sputtering and ALD proecesses
Journal article2008, Microelectronic Engineering, (85) 10, p.1947-1951Publication Built-in self-limitation of masked aluminum anodization using photoresist
Proceedings paper2011, Eurosensors XXV, 4/09/2011, p.1633-1636Publication Challenges for Capillary Self-Assembly of Microsystems
Journal article2011, IEEE Transactions on Components, Packaging and Manufacturing Technology, (1) 1, p.133-149Publication Changing superfilling mode for copper electrodeposition in blind holes from differential inhibition to differential acceleration
Journal article2009, Electrochemical and Solid-State Letters, (12) 5, p.D39-D41Publication Characteristics of copper electrodeposits on featureless substrates and in microvias with aspect ratio up to 10
Meeting abstract2009, 215th Electrochemical Society Spring Meeting, 24/05/2009, p.997Publication Characterization of ALD diffusion barrier on low-k dielectric polymer by contact angle measurements
Oral presentation2002, New Trends in Applied Surface SciencePublication Characterization of interconnects resulting from capillary die-to-substrate self-assembly
Proceedings paper2008, 2nd Electronics System-Integration Technology Conference - ESTC, 1/09/2008, p.135-140Publication Characterization of the etching of Ge sacrificial layers for surface micromachining of MEMS
Proceedings paper2004, Proceedings 15th Micromechanics Europe Workshop, 5/09/2004, p.115-118Publication Characterization of the growth of atomic layer deposited WNxCy films on various substrates
Publication Comparison between patterned and unpatterned electrodeposited spin-valve sensors
Journal article1999, IEEE Trans. Magnetics, (35) 5, p.3094-3096Publication Conformal dip-coating of patterned surfaces for capillary die-to-substrate self-assembly
Journal article2009, Journal of Micromechanics and Microengineering, (19) 4, p.45015