Browsing by Author "Ceric, H."
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Publication A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability
Journal article2023, JOURNAL OF APPLIED PHYSICS, (134) 13, p.Art. 135102Publication Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds
Journal article2023, JOURNAL OF APPLIED PHYSICS, (133) 10, p.Art. 105101Publication Impact of via geometry and line extension on via-electromigration in nano-interconnects
Proceedings paper2023, 61st IEEE International Reliability Physics Symposium (IRPS), MAR 26-30, 2023Publication Novel concept-oriented synthetic data approach for training generative AI-Driven crystal grain analysis using diffusion model
Journal article2025-MAR, COMPUTATIONAL MATERIALS SCIENCE, (251) March, p.113723Publication Review-Modeling Methods for Analysis of Electromigration Degradation in Nano-Interconnects
Journal article review2021, ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, (10) 3, p.035003Publication Technology benchmarking of copper electromigration using a grain-sensitive simulation framework
Proceedings paper2024, 2024 International Interconnect Technology Conference, 2024-06-03