Browsing by Author "Ceric, Hajdin"
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Publication A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects
Journal article2024, NANOMATERIALS, (14) 22, p.Art. 1834Publication Advanced modeling and simulation of Cu nano-interconnects reliability
Publication Analysis of electromigration failure of nano-interconnects through a combination of modeling and experimental methods
Journal article2019, Microelectronics Reliability, 100-101, p.113362Publication Assessment of Electromigration in Nano-Interconnects
Proceedings paper2019, 16th International Conference on Reliability and Stress-related Phenomena in Nano and Microelectronics - IRSP, 4/11/2019Publication Void-dynamics in nano-wires and the role of microstructure investigated via a multi-scale physics-based model
Journal article2021, JOURNAL OF APPLIED PHYSICS, (129) 12, p.125102