Browsing by Author "Cheng, Edmund"
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Publication A practical approach to thermal modeling and validation of 3D-ICs
Meeting abstract2010, DAC 2010 User Track, 13/07/2010Publication Experimental characterization and model validation of thermal hot spot dissipation in 3D stacked ICs
Proceedings paper2010-10, 16th International Workshop on Thermal investigations of ICs and Systems - Therminic, 6/10/2010Publication Fine grain thermal modeling of 3D stacked structures
Proceedings paper2009-10, 15th International Workshop on Thermal inverstigations of ICs and Systems - THERMINIC, 7/10/2009, p.45-49Publication Thermal modeling and experimental validation of thermal effects of 3D-ICs
Oral presentation2010, 3D Integration Workshop at DATE 2010