Browsing by Author "Christiaens, Filip"
- Results Per Page
- Sort Options
Publication A generic methodology for deriving compact dynamic thermal models, applied to the PSGA package
Journal article1998, IEEE Trans. Components, Packaging, and Manufacturing Technology. Part A, (21) 1, p.265-271Publication CIMID, A technology for high density integration of electronic systems
Proceedings paper1994, Proceedings of 27th International Symposium on Microelectronics - ISHM'94, 15/11/1994, p.226-231Publication Compact transient thermal models for the polymer stud grid array (PSGATM) package
Oral presentation1997, Eurotherm Seminar 58: Thermal Management of Electronic SystemsPublication Das Stud-Grid-Array - eine kostengünstige Lösung für den Einbau vielpoliger ICs
Journal article1996, SMT, p.23-24Publication Evaluation of structural degradation in packaged semiconductor components using a transient thermal characterisation technique
Journal article1996, Microelectronics and Reliability, (36) 11_12, p.1807-1810Publication Experimental thermal characterisation of electronic components by means of the submerged double jet impingement (SDJI) method
Proceedings paper1997, International Systems Packaging Symposium - ISPS, 2/12/1997, p.254-259Publication Experimental thermal characterisation of electronic packages in a fluid bath environment
Proceedings paper1997, Thermal Management of Electronic Systems II. Proceedings of EUROTHERM Seminar No 45, 20/09/1995, p.137-148Publication Improved solder joint reliability in polymer stud grid array packages by structural design optimisation
Oral presentation1996, Weichlöten in Forschung und PraxisPublication Measurement circuits for transient thermal characterization of power transistors and transformers
Proceedings paper1994, 17th National Conference on Circuit Theory and Electronic Networks, 19/10/1994, p.359-364Publication Modeling of thermal vias in thin film multichip modules
Proceedings paper1994, Intersociety Conference on Thermal Phenomena in Electronic Systems. I-THERM IV. "Concurrent Engineering and Thermal Phenomena", 04/05/1994, p.101-107Publication Modelling of thermal vias in high density interconnection structures
Proceedings paper1994, 1st European Conference on Electronic Packaging Technology - EUPAC, 01/02/1994, p.110-114Publication Optimising the solder joint reliability of polymer stud grid array (PSGATM) packages using thermo-mechanical analysis
Oral presentation1997, Eurotherm Seminar 58: Thermal Management of Electronic SystemsPublication Parametric compact models for flip chip assemblies
Proceedings paper1999, 5th International Workshop Thermal Investigations of ICs and Systems - THERMINIC, 3/10/1999, p.312-318Publication Parametric compact models for flip chip assemblies
Journal article2000, IEEE Trans. Components and Packaging Technologies, (23) 3, p.555-561Publication Simulation of solder joint reliability for CBGA packages
Proceedings paper2001, Proceedings 13th European Microelectronics and Packaging Conference & Exhibition; 30 May - 1 June 2001; Strasbourg, France., p.360-364Publication The Plastic Stud Grid Array, a low cost solution for packaging and assembling high pin count devices
Proceedings paper1995, IEEE CPMT Workshop on Flip Chip and Ball Grid Arrays, 13/11/1995Publication The polymer stud grid array package
Oral presentation1996, International Symposium "Die Oberflächentechnik heute und morgen"Publication The polymer stud grid array package
Proceedings paper1996, Proceedings of the 1996 International Electronics Packaging Conference IEPS, 29/09/1996, p.213-223Publication The stud grid array, a low cost solution for packaging and assembling high pin count devices
Proceedings paper1995, VLSI Packaging Workshop: Spotlight BGA, 16/10/1995, p.70-72Publication The Submerged Double Jet Impingement (SDJI) method for thermal testing of packages