Browsing by Author "Christiaens, Wim"
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Publication 3D integrated ultra-thin functional microcontroller device for wireless, flexible ECG systems
Proceedings paper2009, International Semiconductor Technology Conference - ISTC/CSTIC, 19/03/2009, p.707-712Publication 3D integration of ultra-thin functional devices inside standard multilayer flex laminates
Proceedings paper2009, 17th European Microelectronics and Packaging Conference & Exhibition - EMPC, 15/06/2009Publication 3D-stacking of UTCPs as a module miniaturisation
Proceedings paper2011, 44th International Symposium on Microelectronics - IMAPS, 9/10/2011, p.463-468Publication A reliable and comfortable package for wearable medical devices
Oral presentation2011, IMAPS Advanced Technology Workshop Microelectronic Packaging for Medical and Hi-Rel DevicesPublication Active and passive component integration in polyimide interconnection substrates
Christiaens, WimPHD thesis2009Publication Active optical links embedded in flexible substrates
Proceedings paper2008, 58th Electronic Components & Technology Conference - ECTC, 27/05/2008, p.1150-1157Publication Design and implementation of flexible and stretchable systems
Journal article2011, Microelectronics Reliability, (51) 6, p.1069-1076Publication Embedded chips redefine miniaturization: inexpensive, high-performance packages can be fabricated by laminating thin, flexible, mechanical devices into conventional multiilayer circuit boards
Journal article2009, Printed Circuit Design & Fab, p.37-39Publication Embedding and assembly of ultrathin chips in multilayer flex boards
Journal article2008, Circuit World, (34) 3, p.3-8Publication Embedding of active components in multilayer flex boards
Proceedings paper2007, IMAPS MicroTech: Advanced Interconnection, 6/03/2007Publication Embedding of optical interconnections in flexible electronics
Proceedings paper2007, 57th Electronic Components and Technology Conference, 29/05/2007, p.1281-1287Publication Embedding thinned dies in flexible PCBs
Proceedings paper2012, 4th Electronics System Integration technologies Conference - ESTC, 17/09/2012Publication Fabrication processes for embedding thin chips in flat flexible substrates
Journal article2009, IEEE Transactions on Advanced Packaging, (32) 1, p.77-83Publication Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology
Journal article2010, IEEE Transactions on Advanced Packaging, (33) 1, p.72-78Publication Flexible embedded active optical link
Proceedings paper2008, Micro-Optics 2008, 7/04/2008, p.69920VPublication Flexible wireless biopotential system with embedded ultra-thin chip
Proceedings paper2009, Smart Systems Integration Conference, 10/03/2009, p.536-539Publication Functionality and reliability testing of bendable ultrathin chip packages (UTCP's)
Meeting abstract2008, Proceedings of the IMAPS Nordic Annual Conference, 14/09/2008, p.230Publication High density 3D die stacking without through-Si-vias: ultra thin chip embedding as enabling technology
Proceedings paper2008, SEMICON Europe: Advanced Packaging Conference, 7/10/2008Publication Improved passive-matrix multiplexability with a modular display and UTCP technology
Journal article2009, Displays, (30) 2, p.71-76Publication Integration of thin flexible RF structures into flexible PCB
Proceedings paper2007, 16th European Microelectronics and Packaging Conference - EMPC, 17/06/2007, p.621-626