Browsing by Author "Corlatan, D."
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Publication Experimental investigation of currents and efficiencies in SrS:Ce thin-film electroluminescent devices
Publication Experimental validation of a star-shaped thermal compact model for underfilled flip chip assemblies
Proceedings paper2002, Proceedings of the 8th International Workshop on Thermal Investigations of ICs and Systems - Therminic, 1/10/2002, p.46-49Publication Field dependence of the cross-section for excitation of Ho and Mn in ZnS based electroluminescent devices
Publication HIPERPRINT= a board technology for high-frequency applications
Proceedings paper2000, IMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings, 18/06/2000, p.326-332Publication Mixed component integration in advanced printed wiring boards
Proceedings paper1999, EC-MCM - The 5th European Conference on MultiChip Modules, 1/02/1999Publication Mixed component integration in MCM-L technology
Proceedings paper1999, CARTS Europe - 13th European Passive Components Symposium, 18/10/1999, p.113-118Publication Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages
; ; Publication Parametric compact models for flip chip assemblies
Proceedings paper1999, 5th International Workshop Thermal Investigations of ICs and Systems - THERMINIC, 3/10/1999, p.312-318Publication Parametric compact models for flip chip assemblies
Journal article2000, IEEE Trans. Components and Packaging Technologies, (23) 3, p.555-561Publication Photovia technology: some important aspects for reliability
Proceedings paper1999, Proceedings of the IMAPS; October 1999; Chicago, USA., p.240-245Publication Properties of charge carriers in ZnS and their effect on the excitation of Mn
Publication Simulation and measurement of multiplication in thin film electroluminescent devices with doped probe layers
Publication Simulation of solder joint reliability for CBGA packages
Proceedings paper2001, Proceedings 13th European Microelectronics and Packaging Conference & Exhibition; 30 May - 1 June 2001; Strasbourg, France., p.360-364Publication Standard SMT process for flip-chip assembly on FR4 substrate
Publication UV induced charge transfer and light emission in ZnS based electroluminescent devices with probe layers
Publication UV-induced charge transfer and light emission in ZnS based electroluminescent devices with probe layers