Browsing by Author "Criel, Steven"
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Publication Accurate characterization of some radiative EMC phenomena at chip level, using dedicated EMC-testchips
Proceedings paper1998, International Symposium on Electromagnetic Compatibility. Symposium Record, 24/08/1998, p.734-738Publication Accurate finite difference time domain (FD-TD) analysis of arbitrary coaxial shields using the triaxial-cell characterization procedure
Proceedings paper1995, Atlanta 1995.EMC - a Global Concern. IEEE 1995 International Symposium on Electromagnetic Compatibility. Symposium Record; Augus, p.179-182Publication Approximate simulation of the shielding effectiveness of a rectangular enclosure with a grid wall
;De Smedt, R. ;De Moerloose, Jan ;Criel, Steven; ;Olyslager, FrankProceedings paper1998, International Symposium on Electromagnetic Compatibility. Symposium Record, 24/08/1998, p.1030-1034Publication Assessment of the shielding effectiveness of a real enclosure
;De Smedt, R. ;De Moerloose, Jan ;Criel, Steven; ;Olyslager, FrankProceedings paper1998, EMC'98. International Symposium on Electromagnetic Compatibility, 14/09/1998, p.248-253Publication Comparison of FDTD and MoM for shielding effectiveness modelling of test enclosures
;De Moerloose, Jan ;Criel, Steven ;De Smedt, R.; ;Olyslager, FrankProceedings paper1997, Proceedings of the IEEE 1997 International Symposium on Electromagnetic Compatiblity, 18/08/1997, p.596-601Publication EMC-Modelling and Characterisation of Coaxial Shieldings and of the Radiation of PCB's
Criel, StevenPHD thesis1995-11Publication Evaluation of a New Measurement Set-up for the Accurate Characterisation of the Near-Field Radiated Emission of Printed Circuit Boards
Proceedings paper1994, Proceedings of the IEEE 3rd Topical Meeting of Electrical Performance of Electronic Packaging, 2/11/1994, p.51-53Publication Mixed assembly of PCB using a novel flip-chip technology
Journal article2000, Advancing Microelectronics, (27) 5, p.28-30Publication Mixed assembly on PCB using a novel flip-chip technology
Proceedings paper2000, IMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings, 18/06/2000, p.65-70Publication Near- and Far-Field Characterization of Perforated Screens: Theoretical and Experimental Study of Proposed Definitions for the Shielding Performance
Proceedings paper1994, 1994 IEEE International Symposium on Electromagnetic Compatibility, 22/08/1994, p.298-302Publication Near-field scanner for the accurate characterization of electromagnetic fields in the close vicinity of electronic devices and systems
Proceedings paper1996, Proceedings IEEE Instrumentation and Measurement Technology Conference, 4/06/1996, p.1119-1123Publication Numerical and experimental study of the shielding effectiveness of a metallic enclosure
Journal article1999, IEEE Trans. Electromagnetic Compatibility, (41) 3, p.202-213Publication Simulations of small apertures and grids by the FDTD method
Proceedings paper1998, EMC'98. International Symposium on Electromagnetic Compatibility, 14/09/1998, p.328-332Publication Theoretical and experimental determination of the shielding effectiveness of test enclosures
Proceedings paper1997, Proceedings of the 12th International Zürich Symposium and Technical Exhibition on Electromagnetic Compatibility, 18/02/1997, p.223-228Publication Theoretical and experimental near-field characterization of perforated shields
Journal article1994, IEEE Trans. Electromagnetic Compatibility, (36) 3, p.161-168Publication Theoretical and experimental quantitative characterization of the near-fields of printed circuit board interconnection structures
Proceedings paper1995, Atlanta 1995.EMC - a Global Concern. IEEE 1995 International Symposium on Electromagnetic Compatibility. Symposium Record; Augus, p.471-474