Browsing by Author "Cui, Hushan"
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Publication Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: application to accelerometers
; ; Proceedings paper2011, IEEE 24th International Conference on Micro Electro Mechanical Systems - MEMS, 23/01/2011, p.352-355Publication Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration
Meeting abstract2010, 10th International Symposium on Ultra-Clean Processing of Semiconductor Devices - UCPSS, 19/09/2010, p.188-189Publication Wafer level characterization of the sacrificial HDP oxide lateral etching by anhydrous vapor HF with ethanol vapor for SiGe MEMS structures
Proceedings paper2010, Chemical Sensors 9 - and MEMS/NEMS 9, 10/10/2010, p.295-307Publication Wafer level characterization of the sacrificial HDP oxide lateral etching by anhydrous vapor HF with ethanol vapor for SiGe MEMS structures
Meeting abstract2010, 218th ECS Meeting Symposium J3: Microfabricated and Nanofabricated Systems for MEMS/NEMS 9, 10/10/2010, p.2333