Browsing by Author "Druais, Gael"

Now showing 1 - 3 of 3

High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed

Druais, Gael
;
Dilliway, Gabriela
;
Fischer, P.
;
Guidotti, E.
;
Bureau, C.
;
Palmans, Roger
Meeting abstract
2008, 17th Workshop Materials for Advanced Metallization, 2/03/2008, p.43-44
High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed

Druais, Gael
;
Dilliway, G.
;
Fischer, P.
;
Guidotti, E.
;
Luhn, Ole
;
Radisic, Alex
;
Zahraoui, S.
Journal article
2008, Microelectronic Engineering, (85) 10, p.1957-1961
Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask

Van Olmen, Jan
;
Al-Bayati, A
;
Beyer, Gerald
;
Boelen, Pieter
;
Carbonell, Laure
;
Zhao, Chao
Oral presentation
2007, Advanced Metallization Conference - AMC