Browsing by Author "Gillon, Renaud"
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Publication Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
Journal article2012, Microelectronics Reliability, (52) 11, p.2677-2684Publication Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages
Proceedings paper2010, 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics - EuroSimE, 26/04/2010Publication Impact of moisture absorption on warpage of large BGA packages during a lead-free reflow process
Proceedings paper2009-10, 15th International Workshop on Thermal Investigations of IC's and Systems - THERMINIC, 7/10/2009Publication Impact of mold compound filler particles on local thermo-mechanical stress variations
Publication Impact of thermal ageing on cohesive and adhesive strengths of overmould materials: characterisation methods and implementation in FEM
Proceedings paper2011-04, 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE, 18/04/2011Publication Practical chip-centric electro-thermal simulations
Proceedings paper2008-09, 14th International Workshop on Thermal Inveatigations of ICs and Systems - THERMINIC, 24/09/2008, p.220-223Publication The power of green compounds for automotive
Oral presentation2010, IMAPS Benelux Seminar