Browsing by Author "Gopinath, Sanjay"
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Publication Advanced metallization scheme for 3×50μm via middle TSV and beyond
; ; ; ; ; Proceedings paper2015, IEEE 65th Electronic Components & Technology Conference - ECTC, 26/05/2015, p.66-72Publication Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module
Proceedings paper2016, IEEE International Conference on 3D System Integration - 3DIC, 8/11/2016, p.1-4Publication Reliability study of liner/barrier/seed options for via-middle TSV's with 3m diameter and below
Proceedings paper2015, International Interconnect Technology Conference - IITC and Materials for Advanced Metallization Conference - MAM, 18/05/2015, p.327-330