Browsing by Author "Guerrieri, Stefano"
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Publication A 7-band CCD-in-CMOS multispectral TDI imager
Proceedings paper2017, International Image Sensor Workshop - IISW, 30/05/2017Publication A high-speed imager with low-power PTC-inspired column-multiplexed readout
Proceedings paper2017, International Image Sensor Workshop, 30/05/2017, p.157-160Publication An adaptive frame image sensor with fine-grained power management for ultra-low power Internet of Things application
Publication Beyond BEOL interconnect wafer level monolithic near-infrared/infrared thin film photo diode image sensor integration
Proceedings paper2019, IEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019), 3/06/2019, p.4.38Publication CCD-in-CMOS platform for Time Delay Integration
Meeting abstract2018, Small Satellites for Earth Observation Conference, 28/05/2018Publication Co-Sn intermetallic compoundsfor potential integration in 3D interconnects
Meeting abstract2014, 23rd Conference on Materials for Advanced Metallization - MAM, 2/03/2014Publication Cobalt UBM for fine pitch microbump applications in 3DIC
Proceedings paper2015, IEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM, 18/05/2015, p.221-224Publication Copper oxide direct bonding of 200 mm CMOS wafers with five metal levels and TSVs: morphological and electrical characterization
; ; ; ; Guerrieri, StefanoProceedings paper2016, Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 8, 2/10/2016, p.43-46Publication Copper oxide direct bonding of 200mm CMOS wafers: morphological and electrical characterization
Proceedings paper2015, IMAPS 48th Annual international symposium on Microelectronics, 26/10/2015, p.594-597Publication EuroCMOSHF: demonstration of a fully European supply chain for space image sensors
; ; ; ; Meynants, GuyMeeting abstract2016, International Conference on Space Optics - ICSO, 18/10/2016, p.141Publication Failure analysis challenges for 3D stacked ICs
Meeting abstract2014, International ESD Workshop - IEW, 19/05/2014Publication High speed backside illuminated TDI CCD-in-CMOS sensor
Meeting abstract2017, International Image Sensor Workshop, 30/05/2017, p.364-367Publication Hybrid copper dielectric direct bonding of 200mm CMOS wafers with five metal levels: morphologic, electrical and reliability characterization
Proceedings paper2017, International Wafer-Level Packaging Conference - IWLP, 24/10/2017Publication Imager technologies for high speed applications
Proceedings paper2016, 31st International Congress on High-speed Imaging and Photonics - ICHSIP, 7/11/2016, p.84-89Publication Integration of PbS quantum dot photodiodes on silicon for NIR imaging
Journal article2020, IEEE Sensors Journal, (20) 13, p.6841-6848Publication Metrology and inspection challenges for manufacturing 3D stacked IC's
Proceedings paper2013, 24th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC, 13/05/2012, p.75-79Publication Monolithically integrated quantum-dot based image sensor for low cost high resolution NIR/SWIR applications
Meeting abstract2019, Space and Scientific CMOS Image Sensors, 26/11/2019Publication Multi-spectral high-speed backside illuminated TDI CCD-in-CMOS imager
Meeting abstract2019, International Image Sensor Workshop 2019, 23/06/2019, p.P101Publication Multispectral time delay integration image sensor for high resolution earth observation
Meeting abstract2019, 12th IAA Symposium on Small Satellites for Earth Observation (SMALLSAT), 6/05/2019Publication Ni Oxidation study for 3D Interconnect Application