Browsing by Author "Herms, Martin"
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Publication A photo-elastic microscopy study of the temperature dependecy of stress induced by through silicon vias in silicon
Journal article2017, Physica Status Solidi C, (14) 7, p.1700028Publication Copper through silicon vias studied by the photo-elastic Scanning Infrared Microscope SIREX
Journal article2016, Microelectronics Reliability, 64, p.330-335Publication Defect-induced stress imaging in single and multi-crystalline semiconductor materials
Journal article2018, Materials Today, (5) 6, p.14748-14756Publication Failure and stress analysis of Cu TSVs using
Proceedings paper2015, 41st International Symposium for Testing and Failure Analysis - ISTFA, 1/11/2015, p.119-25Publication Materials characterization and device analysis for evaluation of semiconductor processes by highly-sophisticated photoelastic stress measurement technique
Journal article2015, Physica Status Solidi C, (12) 8, p.1085-1089Publication Photo-elastic characterization of defect structures in mono and multi-crystalline semiconductor materials
Meeting abstract2016-09, Extended Defects in Semiconductors (EDS) Conference, 25/09/2016, p.77