Browsing by Author "Hiro, Akito"
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Publication An Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding Sysem
Proceedings paper2023, IEEE 73rd Electronic Components and Technology Conference (ECTC), MAY 30-JUN 02, 2023, p.1677-1681Publication Clean Dicing: An Alternative Blade Dicing Technique for Minimising Particles in 3D Heterogeneous Integration
; ; ; ; ; Proceedings paper2024, 2024 International 3D Systems Integration Conference, SEP 25-27, 2024Publication Dicing Lane Quality Quantification & Wafer Assessment Using Image Thresholding Techniques
Proceedings paper2024, 10th IEEE Electronics System-Integration Technology Conference (ESTC), SEP 11-13, 2024Publication One micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric material
Proceedings paper2018, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 4/12/2018, p.395-400Publication Ru CMP for advanced metallization
Proceedings paper2019-09, International Conference on Planarization/CMP Technology 2019, 15/09/2019